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Huawei is creating a real 5 nm manufacturing line with out the necessity for EUV lithography machines. Moreover, 3 nm chips are already within the R&D stage, with plans to start out manufacturing by 2026, in line with a report by UDN.
Huawei can’t use commonplace EUV know-how, as it’s patented by the Dutch firm ASML, which is banned from working with the Chinese language producer. As an alternative, the corporate is utilizing SSA800 lithography machines with multi-patterning, made by Shanghai Micro Electronics (SMEE).
Analysis and growth for 3nm chips are following two approaches: one is GAA structure (the usual one, utilized by TSMC and Samsung), and the opposite is a carbon nanotube-based chip that has already accomplished lab validation and is now being tailored for SMIC’s manufacturing strains.
Earlier this month, the Huawei Matebook Fold arrived, powered by Kirin X90. Whereas the corporate calls it a “5nm chip,” it’s really a 7nm design with superior packaging know-how. It brings efficiency on par with different 5 nm chips, however the yield is simply 50%, which is extraordinarily low, making the chip dearer to fabricate.